Infineon Technologies AG today announced the availability of its "Coil on Module" (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic ...

Abstract: This work presents a dual-band coil module for near-field resonant wireless power transfer (WPT). It provides additional channel either for more power transfer or higher data transmission.

Neubiberg, Germany – January 29, 2013 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a worldwide leading manufacturer of semiconductor solutions for payment applications, today introduced its ...

Abstract: Dual-band coil modules facilitate efficient access to distinct-band, high-power, or rapid-charging wireless power transfer (WPT) systems. However, they do not function efficiently when the ...

Infineon, a manufacturer of semiconductor solutions for payment applications, introduced its Coil on Module chip package to support global distribution of dual interface bank and credit cards. The new ...

Infineon is expanding its CoM (Coil on Module) portfolio for secure contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate ...

Ian Thomas, product manager at Trox UK, looks at the problems inherent in refurbs and introduces an ideal solution for projects with less-than-ideal limitations. Refurbishment projects vary enormously ...