The process control and instrumentation minor emphasizes developing skills and knowledge in theory, software and in the field. Students graduate ready to solve complex control problems in the chemical ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Advanced process technologies, such as 90nm, 65nm, 45nm and below, present significant power management challenges for high performance semiconductors. Chip designers face increasing challenges in ...
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