Start-up semiconductor packaging supplier Ziptronix Inc. has developed a MEMS encapsulation process it said can reduce the high packaging costs that have delayed the acceptance of MEMS technology. The ...

Abstract: The ultimate driving forces for the development of small form-factor chip scale packages (CSPs) are the market demands for small, light and high performance products. The flex-based /spl ...

Abstract: Solid-state lighting (SSL) using high brightness light emitting diodes (HB-LEDs) is the emerging trend for general lighting applications. It is expected a substantial portion of conventional ...

UK company, TasteTech have developed a new method for processing paprika and turmeric spices. The method is a controlled release encapsulation, whereby... UK company, TasteTech have developed a new ...

Researchers in Italy have developed a low temperature a blanket-cover encapsulation technique that reportedly improves the stability of perovskite PV devices. They said the new technique reduces ...

The commissioning of a system for drying used nuclear fuel assemblies before they are sealed within copper canisters for final disposal has taken place at Finnish waste management company Posiva's ...