Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Dynamic optimisation and model predictive control (MPC) are at the forefront of modern process systems engineering, offering robust methodologies to address the challenges posed by time-varying ...

Some wonder if AI will replace PID control loops. The reality is that, instead of replacing PID, AI is stepping in to help keep things running smoothly without upending regulatory trust. Think of AI ...

As chips shrink to the nanometer scale, precise control over every fabrication step becomes essential. Atomic layer deposition (ALD) has emerged as a cornerstone of nanoelectronics, enabling the ...